According to IMARC Group’s latest report, titled “Flip Chip Technology Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027.’ the global flip chip technology market reached a value of US$ 27.55 Billion in 2021. Flip chip, or direct chip attach, technology refers to a semiconductor packaging solution that includes conductive bumps deposited on the chip pads. It is utilized for interconnecting semiconductor devices and micromechanical systems to the circuitry. The flip chip technology is further used for assembling gaming devices, chipsets, and central processing units (CPU) on account of its effective microwave and ultrasonic operations.
We are regularly tracking the direct effect of COVID-19 on the market, along with the indirect influence of associated industries. These observations will be integrated into the report.
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The widespread adoption of flip chip technology in robotic solutions and consumer electronics for minimal power, improved electrical efficiency and device miniaturization is majorly driving the market growth. In line with this, the increasing utilization of the technology across the telecommunication, healthcare, aerospace, and defense industries for geo-sensing is acting as another growth-inducing factor. Furthermore, rapid technological advancements, such as cloud computing and the Internet of Things (IoT), and the establishment of research and development (R&D) projects are some of the other factors creating a positive outlook in the global flip chip technology market. Looking forward, IMARC Group expects the market to reach US$ 39.67 Billion by 2027, exhibiting at a CAGR of 6.4% during 2022-2027.
- 3M Company
- Amkor Technology Inc.
- ASE Group
- Fujitsu Limited
- Intel Corporation
- Jiangsu Changdian Technology Co. Ltd.
- Powertech Technology Inc.
- Samsung Electronics Co.Ltd.
- Taiwan Semiconductor Manufacturing Company Limited
- Texas Instruments Incorporated
- United Microelectronics Corporation.
Key Market Segmentation:
Breakup by Product:
- CMOS Image Sensor
- RF, Analog, Mixed Signal and Power IC
Breakup by Packaging Technology:
- 3D IC
- 5D IC
- 2D IC
Breakup by Bumping Technology:
- Copper Pillar
- Solder Bumping
- Gold Bumping
Breakup by Industry Vertical:
- Automotive and Transport
- IT and Telecommunication
- Aerospace and Defense
Breakup by Region:
- North America (United States, Canada)
- Europe (Germany, France, United Kingdom, Italy, Spain, Others)
- Asia Pacific (China, Japan, India, Australia, Indonesia, Korea, Others)
- Latin America (Brazil, Mexico, Others)
- Middle East and Africa (United Arab Emirates, Saudi Arabia, Qatar, Iraq, Others)
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Key highlights of the report:
- Market Performance (2016-2021)
- Market Outlook (2022-2027)
- Market Trends
- Market Drivers and Success Factors
- The Impact of COVID-19 on the Global Market
- Value Chain Analysis
- Structure of the Global Market
- Comprehensive mapping of the competitive landscape
If you need specific information that is not currently within the scope of the report, we will provide it to you as a part of the customization.
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